X-Band 16-Channel Standardized Phased Array
A scalable 4×4 surface-mount sub-array engineered for low-altitude anti-jamming, precise detection, and SATCOM networks. Delivering superior phase consistency and highly cost-effective mass production capability.
SMT Integration
Replaces traditional bulky T/R modules with an automated Surface-Mount Technology (SMT) process, drastically lowering mass-production costs while improving electrical consistency.
High-Precision Beamforming
Features embedded 6-bit phase shifting alongside 5-bit transmit and 6-bit receive attenuation, delivering tight beam synthesis across a ±45° scan range.
Ultra-Compact Profile
The entire 16-channel array is packed into a 69.4 × 69.4 × 2.9 mm footprint, utilizing a 17.4 mm channel spacing optimized for X-band wavelengths.
Robust RF Output
Operates efficiently within the 9.2 - 9.8 GHz band, achieving a solid 55.5 dBm normal EIRP and 27 dBm single-channel transmit power at a 24% emission efficiency.
X-Band 16-Channel Standardized Phased Array
TOPOLOGY: 4×4 SUB-ARRAYOptimized for the phased array radar domain, this highly scalable sub-array allows hardware architects to rapidly configure custom aperture sizes based on specific operational requirements. It integrates 16 transmit-receive (T/R) channels configured in a 4×4 matrix into an ultra-low-profile footprint. By utilizing an automated surface-mount (SMT) process, it guarantees stringent electrical phase consistency across multi-tile deployments while significantly reducing overall system weight and production costs compared to traditional T/R modules.
This 16-channel tile is designed as the ultimate building block for scalable anti-jamming radar and precise detection terminals. The mechanical architecture dictates an exact 11.2 mm inter-board clearance using VFF3/VFM3 mating terminals, while dedicating specialized 9x9 mm metal pins for efficient 5 W/(m·K) thermal interface dissipation directly from the multi-functional chips. This allows seamless tiling into massive, high-density apertures capable of sustaining 100% duty cycles.
| Technical Parameter | Specification / Requirement |
|---|---|
| Operating Frequency Band | 9.2 GHz ~ 9.8 GHz |
| Array Topology | 16 Channels (4×4 Matrix) |
| Channel Spacing | 17.4 mm |
| Polarization Method | Linear Polarization |
| Electronic Scan Range | ±45° |
| Phase-Shifting Control | 6-Bit |
| High-Precision Attenuation | 5-Bit (Transmit) / 6-Bit (Receive) |
| Maximum Duty Cycle | 100% |
| Single-Channel Tx Power | 27 dBm (Typical) |
| Receive Noise Figure | 3.0 dB (Typical) |
| System EIRP (Normal) | 55.5 dBm (Typical) |
| G/T Sensitivity (Normal) | -12 dB/K (Typical) |
| Emission Efficiency | 24% |
| Port VSWR | 2.0 (50 Ω I/O matching) |
| Technical Parameter | Specification / Requirement |
|---|---|
| Dimensions (L × W × H) | 69.4 × 69.4 × 2.9 mm (Excluding component height) |
| Working Voltage | VDD = +3.3V, NV5 = -5V |
| DC & Control Connector | 2.54mm Pogo 10-Pin × 4 |
| RF Connector | SMP (Male) |
| SPI Interface | 2.54mm Pogo Connector × 2 (J1 & J2) |
| Power Supply Interface | 2.54mm Pogo Connector (J3 & J4) |
| Inter-Board Integration | 11.2 mm final clearance (Female: VFF3-05D41511CN1 / Male: VFM3-05D314D11S1) |
| Thermal Interface | 4 × Multi-functional chips cooled via 9x9mm metal pins (5 W/(m·K) thermal material) |
| Operating Temperature | -40 °C to +60 °C |
| Storage Temperature | -55 °C to +85 °C |