Integrating a 256-channel active array requires clearly defined RF, power, control, mechanical, and thermal interfaces between the antenna front-end and the host platform. In radar tracking and directional communication applications, the Ku-band 256-channel two-dimensional phased array antenna integrates 256 active channels, an antenna-in-package (AIP) module, and an internal RF power divider within a unified 220 mm × 310 mm × 54 mm enclosure weighing ≤3 kg, providing a defined integration boundary for the host platform.
Host Platform Interfacing for 2D Active Arrays
The host platform does not directly access the 16 × 16 internal channel architecture; integration is accomplished through defined RF, power, control, and mechanical boundaries:
Technical Specs & Engineering Support
Need complete electrical parameters, S-parameter data, or custom RF design support for this series?
- Integrated Array Structure: The chassis integrates the antenna structure, AIP module, internal RF power divider, and sum/difference network within a single housing.
- Defined External Interfaces: The RF, power, and control functions are exposed through defined external interfaces.
- Aperture and Steering Boundary: The planar radiating aperture integrates 256 elements in a 16 × 16 symmetric grid, supporting electronic beam steering of ±45° in azimuth and ±40° in pitch.
RF Boundary and Input Drive Requirements
The RF interface establishes the signal boundary between external exciter/receiver stages and the array front-end:
- RF Connector Standard: The RF interface uses an SMA-J connector for the Ku-band RF path across the 15 GHz to 17 GHz operating band.
- Input Excitation Level: The array accepts an RF input drive level of 20 dBm ± 1 dBm.
- Internal Distribution and Transmit Levels: The antenna front-end incorporates an internal RF power divider, with the RF interface specified as SMA-J. Downstream system designers should account for the specified transmit output levels:
| Parameter | Specification / Requirement |
| Operating Frequency Band | 15 GHz – 17 GHz |
| Input Excitation | 20 dBm ± 1 dBm |
| Single-Channel Peak Power | ≥27 dBm |
| Full Array Peak Power | ≥51 dBm |
| System EIRP (Normal) | ≥79 dBm (room temperature) |
Power Bus Boundary and Pulsed Operation Constraints
Operating active solid-state amplification channels under pulsed conditions requires proper DC bus provisioning:
- Prime Power Bus (DC 18 V – 36 V): The 18–36 V DC input range provides flexibility for integration with different host-platform power architectures.
- Prime Power Interface: Prime DC power is provided through the dedicated J30J_04P04P000C00000 high-current connector.
- Specified Power Consumption: The specified power consumption is ≤200 W at a 20% transmitting duty cycle.
- Transmitting Duty Cycle Limit: The front-end supports transmitting duty cycles of up to 25%. The host power architecture should be designed to maintain the specified 18–36 V input range under the operating conditions of the array.
Control, Mechanical, and Thermal Boundaries
System engineers must align host installation envelopes with the array’s physical and environmental constraints:
- Control Interface: A dedicated multi-pin J30J_15ZK connector provides the control interface for the active array.
- Mechanical Envelope & Mass: The enclosure defines a mechanical integration envelope of 220 mm × 310 mm × 54 mm (±0.5 mm) with a total mass of ≤3 kg.
- Environmental Ratings: The subsystem is rated for an operating temperature range of -40 °C to +70 °C and a storage temperature range of -50 °C to +70 °C.
- Thermal Management Boundary: System designers should implement appropriate thermal management to maintain the assembly within its specified operating temperature range under the stated power-consumption conditions.
- Surface Finish: The metal cavity features a colored conductive oxide finish, while the external antenna face uses a white primer.
Frequently Asked Questions (System Integration & Electrical Boundaries)
Q: What external RF feed network is required to drive the 256-channel array?
A: The antenna front-end incorporates an internal RF power divider. The host system supplies the specified RF input through the external RF interface, while distribution to the active channels is handled within the antenna assembly.
Q: How should the host power supply be configured for pulsed operation?
A: The platform should supply DC 18 V to 36 V through the J30J_04P04P000C00000 high-current connector. The host power architecture should be designed to supply the specified 18–36 V input range and accommodate ≤200 W power consumption at a 20% transmit duty cycle, with operation supported up to 25% duty cycle.
Q: What thermal considerations must be addressed during platform installation?
A: System designers should provide appropriate thermal management to handle the thermal load associated with operation at the specified power-consumption level, maintaining the assembly within its specified operating temperature range of -40 °C to +70 °C.